You will be working with a multi-disciplinary research team in UK, as well as other Engineers in US and China, to design and optimize the analog and digital ASIC chips for a silicon photonics based integrated 3D FMCW imaging system.
What you'll be doing
✓ Design, verify and document analog ASIC blocks and subsystems (such as driver, TIA, ADC, DAC etc)
✓ Define system architecture and product specifications together with the team.
✓ Design and debug IC layout.
✓ Design and implement ESD circuit.
✓ Collaborate with PCB/layout and photonics engineers to implement the system
✓ Identify and research on novel solutions and draft patent applications when appropriate.
✓ Take on a lead role in ASIC design, implementation and characterization.
✓ Mentor junior engineers
Essential requirements
✓ Post-graduate qualification (Master) or preferable PhD in Engineering fields.
✓ 3+ years of relevant industry experience in Analog/Mixed Signal IC design.
✓ Deep understanding of CMOS analog circuit design practice.
✓ Experience with 10GHz+ ASIC design and layout.
✓ Expert user of ASIC design tools, such as Cadence design environment and Calibre.
✓ Experience in EM simulation with ADS/RFPro tools.
✓ Experience in lab evaluation of IC chips.
✓ Excellent communication skills, critical thinking, attention to details, and self-motivation
Nice to have
✓ Experience of managing a full Tape-out process.
✓ Device modelling experience (Verilog-AMS, Systemverilog, etc).
✓ Knowledge in chip packaging techniques.
✓ Experience in board level discrete components design and layout.
✓ Good understanding of optoelectronics device (MZM, PD, etc).
✓ Experience with integrated optoelectronic system on chip.
✓ Demonstrated ability to generate high quality patents and research papers.
✓ Knowledge in Phase Modulation of optical signal and coherent detection.
✓ Industrial or research experience in LiDAR system.
✓ Experience of coaching and mentoring new or junior engineers.
Please apply online or send your CV to Dr. Xia Chen (xiachen@o-netcom.com).