Together with several industry partners and collaborators, O-Net successfully demonstrated the External Laser Small Form-Factor Pluggable (ELSFP) module during the 47th OFC in San Diego, California on March 8-10, 2022. The O-Net ELSFP module is targeted for using in systems with optical engines in co-packaged applications under the OIF Co-Packaging Framework Implementation Agreement（IA）.

        The O-Net External Laser Small Form-Factor Pluggable (ELSFP) module is a small form factor, high optical power and low power consumption device. The ELSFP module includes 8 channels of Class VHP Continuous Wave (CW) lasers at 1310nm or CWDM wavelength. The device has a blind mate optical connector and an electrical connector, conforming to the OIF ELSFP IA. 

        Leveragingthe outstanding optical coupling technology, the O-Net ELSFP module achieves the best in class coupling efficiency with each channel reaching 20dBm CW output power coupled into the blind mate polarization maintaining (PM) MTP connector for all 8 channels of laser embedded.The ELSFP module is the first to achieve VHP (Very High Power) class in the world. Typical power consumption is below 10W.

        Over the past few years,hyperscale data-center operators have been working with some key players on Co-Packaged Optics for the next generation switch systems.Co-packaged optics will be able to address the next generation switch system integration challenges by reducing the length of the switch-optic interconnects, thus lowering the power consumption of the switch-optic electrical I/O.As part of the CPO framework, ELSFP becomes attractive with some specific advantages below.

· Move the thermal load of the laser sources away from the optical engine and ASIC, and thus reduce thesystem level power density.

· Pluggable form factor helps to ensure total system reliability with “hot swap” replacement capability in the event of laser failure during operation.

· Eye safety is achieved by a blind mate optical connector inside the switch system.

· Laser source from a given ELSFP can feed more than one optical engine.

        With excellentoptical performance, the O-Net ELSFP module will enable the CPOimplementation and help to turnCPO based system into commerciallyviable product in the near future. 

        O-Net Technologies was established in October 2000 and is recognized as a key high-tech enterprise of the National Torch Program and a National Enterprise Technology Center. O-Net is headquartered in Shenzhen, and has subsidiaries or R&D centers in Beijing, Hangzhou, Wuhan, Hong Kong, Thailand, the United States, Canada, and France. The company brand is 'O-Net'. Through 21 years of hard work, O-Net Technologies has grown into one of the largest suppliers of optical components, modules and subsystems in the world and lead in many high-tech fields of silicon photonics, laser chip, optical coating and optoelectronic packaging.

        In the past ten years, O-Net Technologies has continuously invested in research and development in the core optoelectronic field, and has launched a variety of self-development class III-V laser, including 980nm PUMP and Raman PUMP for optical amplifiers, 1550nm DFB seed laser source for LiDAR, Gain chip for integrated coherent tunable laser and Mixer chip for integrated coherent receiver.

        In 2021, O-Net Technologies established a R&D center for a silicon photonics in Silicon Valley, USA, and a number of talents joined. With the talent's successful experience in 100G and 200G interconnect applications, O-Net Technologies is focusing on the R&D of silicon photonic chip for 400G and the next generation coherent transceivers, as well as the development of 1.6T transceivers and optical engines for CPO applications. At present, O-Net Technologies has possessed the research and development capabilities of core optoelectronic chips with the three major materials of indium phosphide, gallium arsenide and silicon photonics, which will help O-Net Technologies achieve greater success years to come.